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ADL ENGINEERING INC

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    206,498
About

ADL ENGINEERING INC has a total of 36 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, China and Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are FLIPCHIP INT LLC, LBSEMICON CO LTD and CHIPMOS TECHNOLOGIES INC.

Patent filings in countries

World map showing ADL ENGINEERING INCs patent filings in countries
# Country Total Patents
#1 Taiwan 20
#2 China 14
#3 Japan 1
#4 United States 1

Patent filings per year

Chart showing ADL ENGINEERING INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jow En Min 8
#2 Zhuo Enmin 6
#3 Kang Cheng-Yu 4
#4 Jow En-Min 4
#5 Yang Wen Kun 4
#6 Lin Nan Chun 3
#7 Yang Cheng-Hsiung 3
#8 Lin Nan-Chun 3
#9 Enmin Zhuo 2
#10 Chen Wen Chuan 2

Latest patents

Publication Filing date Title
CN105185716A ELectronic package, package carrier, and methods of manufacturing electronic package and package carrier
CN104701188A Electronic package, package carrier, and method of manufacturing package carrier
TW201316477A Package module with emi shielding
TW201312798A LED package structure having a light-reflecting cover and fabrication method thereof
CN102779767A Semiconductor package structure and manufacturing method thereof
TW201232745A Package module with EMI shielding
TW201244572A Semiconductor package structure and method for fabricating the same
TW201237974A Semiconductor package structure and method for fabricating the same
TW201232676A Injection molding system and method of chip package
TW201227913A Three-dimensional system-in-package package-on-package structure
CN104658919A Quad-flat no-lead packaging method
CN102455373A Probe card structure
TW201215894A Probe card
CN102386105A Packaging method with four flat sides and without pin and structure manufactured by packaging method
CN102386104A Quadrilateral flat pin-free encapsulation method
TW201207966A Package method for quad flat no-lead package
TW201207965A Package method for quad flat no-lead package and its structure formedby
TW201142959A Package method for quad flat no-lead package and its structure formedby
TW201042738A Multi-metal layers of trace structure and the method of forming the same
TW200939448A Semiconductor device package structure with multi-chips and method of the same