| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 5 | |
| #2 | Republic of Korea | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | Singapore | 1 | |
| #5 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Maeda Toru | 4 |
| #2 | Seyama Kohei | 4 |
| #3 | Noguchi Yuichiro | 3 |
| #4 | Takayama Shin | 2 |
| #5 | Ozaku Takayoshi | 1 |
| #6 | Hayashi Sei | 1 |
| #7 | Tei Shinsuke | 1 |
| #8 | Allen Wynn | 1 |
| #9 | Nomura Katsutoshi | 1 |
| #10 | Taira Naoya | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2020090957A1 | Electronic component mounting apparatus | |
| JP2020065004A | Mounting apparatus and manufacturing method of semiconductor device | |
| JP2019176083A | Connection state determination device and connection state determination method | |
| JP2019176111A | Wire boding device, manufacturing method of semiconductor, and the semiconductor | |
| JP2019175954A | Bonding device | |
| JP2020155425A | Wire bonding device |