LBSEMICON CO LTD has a total of 21 patent applications. It decreased the IP activity by 60.0%. Its first patent ever was published in 2010. It filed its patents most often in Republic of Korea, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors and surface technology and coating are SMIC CHANGDIAN SEMICONDUCTOR (JIANGYIN) CO LTD, ADL ENGINEERING INC and SHAOXING TONGXINCHENG INTEGRATED CIRCUIT CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 11 | |
#2 | United States | 6 | |
#3 | WIPO (World Intellectual Property Organization) | 4 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Electrolytic coating production | |
#3 | Coating metallic material |
# | Name | Total Patents |
---|---|---|
#1 | Kwon Jae Jin | 8 |
#2 | Lee Jin Kuk | 6 |
#3 | Kim Young Gu | 4 |
#4 | An Sang Hoon | 4 |
#5 | Kim Do Hyung | 2 |
#6 | Lee Jung Woo | 1 |
#7 | Shin Jin Soo | 1 |
#8 | Lee Jinkuk | 1 |
#9 | Lee Ki Yoon | 1 |
Publication | Filing date | Title |
---|---|---|
KR20200061597A | Methods of fabricating semiconductor package | |
KR20200061598A | Methods of fabricating semiconductor package | |
KR20190070544A | Methods of fabricating semiconductor package using both side plating | |
KR20190066986A | Methods of fabricating semiconductor package using side molding | |
KR101897653B1 | Methods of fabricating compliant bump | |
KR101877897B1 | Methods of fabricating bump structure | |
KR20180009274A | Semiconductor package and method of fabricating the same | |
KR101643333B1 | Method of fabricating bump structure | |
KR101671973B1 | The multi layer metal bump structure and method of fabricating the same | |
KR20130051571A | Bump structure for semiconductor device and manufacturing method thereof | |
KR20120048067A | Method for forming metal bump on semiconductor device |