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MEGIC CORP

Overview
  • Total Patents
    116
About

MEGIC CORP has a total of 116 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, Taiwan and Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are WALSIN ADVANCED ELECTRONICS, ZYCUBE KK and OHKUCHI MATERIALS CO LTD.

Patent filings in countries

World map showing MEGIC CORPs patent filings in countries
# Country Total Patents
#1 United States 50
#2 Taiwan 46
#3 Japan 10
#4 Singapore 6
#5 EPO (European Patent Office) 3
#6 China 1

Patent filings per year

Chart showing MEGIC CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Mou-Shiung 51
#2 Lee Jin-Yuan 31
#3 Lin Mau-Shiung 22
#4 Li Jin-Yuan 18
#5 Huang Ching-Cheng 18
#6 Huang Jin-Cheng 15
#7 Chou Chien-Kang 13
#8 Lin Shih-Hsiung 5
#9 Liu Hsien-Tsung 5
#10 Lei Ming-Da 4

Latest patents

Publication Filing date Title
JP2010239137A Design and assembly of high-performance subsystem
JP2006332694A Method for forming metal bumps on semiconductor surface
TWI250598B Chip structure with bumps and testing pads
TWI236722B Chip structure
TW200603353A Chip structure with redistribution circuit, chip package and manufacturing process thereof
TWI226114B Multi chips assembling structure and method for assembling chips
TWI230989B Chip bonding method
TW200427057A High performance system-on-chip inductor using post passivation process
TW200425366A Method of wire bonding over active area of a semiconductor circuit
US2005186690A1 Method for improving semiconductor wafer test accuracy
US6936531B2 Process of fabricating a chip structure
TWI225288B Chip structure
TW200504926A Chip structure with passive devices and method for forming the same
US2004016948A1 High performance system-on-chip discrete components using post passivation process
TW200425253A Chip structure with capacitor and method for forming the same
US2004070086A1 Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
US6798073B2 Chip structure and process for forming the same
US2004129558A1 Method of metal sputtering for integrated circuit metal routing
TW567590B Circuit structure
TW548745B Method for fabricating a conductive structure on a wafer