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UTAC THAI LTD

Overview
  • Total Patents
    30
  • GoodIP Patent Rank
    197,225
About

UTAC THAI LTD has a total of 30 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States, China and Singapore. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are JIANGSU CHANGJIANG ELECTRONICS, HVVI SEMICONDUCTORS INC and DAWNING LEADING TECH INC.

Patent filings in countries

World map showing UTAC THAI LTDs patent filings in countries
# Country Total Patents
#1 United States 26
#2 China 3
#3 Singapore 1

Patent filings per year

Chart showing UTAC THAI LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sirinorakul Saravuth 20
#2 Nondhasitthichai Somchai 11
#3 Phaowongsa Apichart 3
#4 Panikan Charapaka 2
#5 Suwannaset Vorajit 2
#6 Thipyaporn Somrubpornpinan 2
#7 Charapaka Panikan 2
#8 Sae-Lee Charun 2
#9 Kongthaworn Kasemsan 2
#10 Benjavasukul Woraya 2

Latest patents

Publication Filing date Title
US2015171022A1 Conductive shield for semiconductor package
US2014015117A1 Very extremely thin semiconductor package
US2013280866A1 Lead frame ball grid array with traces under die
US2013337609A1 Lead frame land grid array with routing connector trace under unit
US2013243893A1 Molded leadframe substrate semiconductor package
US2013299979A1 Plated terminals with routing interconnections semiconductor device
US2013302944A1 Methods of manufacturing semiconductor devices including terminals with internal routing interconnections
US8460970B1 Lead frame ball grid array with traces under die having interlocking features
US8461694B1 Lead frame ball grid array with traces under die having interlocking features
US9355940B1 Auxiliary leadframe member for stabilizing the bond wire process
US2011133319A1 Auxiliary leadframe member for stabilizing the bond wire process
US2010233854A1 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
US2009241329A1 Side rail remover
US7790512B1 Molded leadframe substrate semiconductor package
SG149812A1 High pressure cooling nozzle for semiconductor package
US2008299756A1 Method and apparatus for plating a semiconductor package
US8013437B1 Package with heat transfer
US7572168B1 Method and apparatus for high speed singulation
US7656173B1 Strip socket having a recessed portions in the base to accept bottom surface of packaged semiconductor devices mounted on a leadframe for testing and burn-in
US2006097366A1 Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound