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NANTONG FUJITSU MICROELECT CO

Overview
  • Total Patents
    394
  • GoodIP Patent Rank
    6,678
About

NANTONG FUJITSU MICROELECT CO has a total of 394 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD, SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD and UNITED TEST & ASSEMBLY CT LT.

Patent filings in countries

World map showing NANTONG FUJITSU MICROELECT COs patent filings in countries

Patent filings per year

Chart showing NANTONG FUJITSU MICROELECT COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shi Lei 108
#2 Tao Yujuan 72
#3 Ding Wanchun 47
#4 Gao Guohua 38
#5 Lin Zhongmin 34
#6 Wang Honghui 21
#7 Yujuan Tao 20
#8 Shi Jiangen 17
#9 Zhang Tonglong 16
#10 Zhang Weihong 15

Latest patents

Publication Filing date Title
CN106409716A Detection system and detection method of electronic component
CN106252239A A kind of circuit substrate and manufacture method thereof
CN106371040A Chip test device and system
CN106405361A Method and apparatus for testing chip
CN106409784A Fingerprint identification module and preparation method thereof
CN106226676A A kind of chip parameter test system
CN105938803A Rewiring technology
CN106024657A Embedded package structure
CN105957844A Packaging structure
CN105870024A System-level packaging method
CN105895541A Formation method for packaging structure
CN105845672A Package structure
CN106094238A Optical alignment system
CN106024646A Full-coating wafer-level packaging method for semiconductor device
CN105826289A Semiconductor packaging structure
CN105789066A Manufacturing method for semiconductor packaging structure
CN105762084A Packaging method and packaging device for flip chip
CN105914155A Flip chip and package method thereof
CN105810601A Semiconductor chip packaging structure and manufacturing method thereof
CN105845654A Semiconductor packaging device