Learn more

ADVANPACK SOLUTIONS PTE LTD

Overview
  • Total Patents
    132
  • GoodIP Patent Rank
    63,757
  • Filing trend
    0.0%
About

ADVANPACK SOLUTIONS PTE LTD has a total of 132 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 1999. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are CHIPPAC INC, CHIPMOS TECHNOLOGIES INC and STATS CHIPPAC LTD.

Patent filings per year

Chart showing ADVANPACK SOLUTIONS PTE LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chew Hwee-Seng Jimmy 34
#2 Lim Shoa-Siong Raymond 18
#3 Lim Kian-Hock 14
#4 Lim Shoa Siong 14
#5 Lau Kee Kwang 13
#6 Chew Hwee Seng Jimmy 12
#7 Perez Roman 12
#8 Chew Alex 11
#9 Tan Kim Hwee 11
#10 Lim Shoa-Siong 10

Latest patents

Publication Filing date Title
TW201440196A Semiconductor structure and method of fabricating the same
US2014134806A1 Manufacturing methods of semiconductor substrate, package and device
SG11201405931PA Multi-layer substrate for semiconductor packaging
US2013175707A1 Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
TW201322390A Substrate structure, semiconductor package device, and manufacturing method of substrate structure
CN103066051A Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
TW201306199A Semiconductor substrate for making semiconductor package device and manufacturing method thereof
TW201419486A Semiconductor device carrier
CN102208389A Semiconductor package, substrate and manufacturing method thereof
CN101958309A Semiconductor chip interconnection structure and semiconductor package formed using the same
CN104392968A Semiconductor substrate
CN102246261A System for encapsulation of semiconductor dies
TW201423930A Manufacturing methods of semiconductor lead frame, package and device
TW201021181A Semiconductor package and method for manufacturing semiconductor package
TW201110307A Package structure
WO2011027185A1 Package structure
TW200937588A Package structure
CN101924090A Semiconductor packaging element and manufacturing method thereof
CN101207103A Semiconductor encapsulated element and method of manufacture thereof
TW200818437A Chip and manufacturing method thereof