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FLIPCHIP INT LLC

Overview
  • Total Patents
    46
  • GoodIP Patent Rank
    200,006
About

FLIPCHIP INT LLC has a total of 46 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Taiwan, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and optics are NANTONG FUJITSU MICROELECT CO, SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD and YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD.

Patent filings in countries

World map showing FLIPCHIP INT LLCs patent filings in countries

Patent filings per year

Chart showing FLIPCHIP INT LLCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Burgess Guy F 16
#2 Tessier Theodore G 16
#3 Clark David 11
#4 Curtis Anthony P 11
#5 Johnson Michael E 10
#6 Scott Douglas M 8
#7 Curtis Anthony 6
#8 Strothmann Thomas 6
#9 Forcier Robert 5
#10 Stout Eugene A 5

Latest patents

Publication Filing date Title
US2015001684A1 Electroplating using dielectric bridges
US2013196499A1 Method for building vertical pillar interconnect
US2013328203A1 Method for applying a final metal layer for wafer level packaging and associated device
CN103858227A Wafer level applied RF shields
US2013087904A1 Wafer level applied thermal heat sink
CN103890933A High precision self aligning die for embedded die packaging
WO2013023157A2 Thin film structure for high density inductors and redistribution in wafer level packaging
TW200910557A Under bump metallization structure having a seed layer for electroless nickel deposition
US2009057909A1 Under bump metallization structure having a seed layer for electroless nickel deposition
US2008308934A1 Solder bump interconnect for improved mechanical and thermo-mechanical performance
WO2008118193A2 Wafer-level interconnect for high mechanical reliability applications
TW200828548A Wafer-level interconnect for high mechanical relia
US2005087356A1 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
US2005069782A1 Forming partial-depth features in polymer film
US7057292B1 Solder bar for high power flip chips