SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD has a total of 23 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2016. It filed its patents most often in WIPO (World Intellectual Property Organization), China and United States. Its main competitors in its focus markets semiconductors and audio-visual technology are YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD, UNITED TEST & ASSEMBLY CT LT and ZYCUBE KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 11 | |
#2 | China | 6 | |
#3 | United States | 6 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Hu Chuan | 23 |
#2 | Liu Junjun | 23 |
#3 | Guo Yuejin | 15 |
#4 | Prack Edward Rudolph | 15 |
Publication | Filing date | Title |
---|---|---|
WO2018165817A1 | Circuit manufacturing method | |
WO2018165818A1 | Circuit fanning out method | |
WO2018165819A1 | Circuit line connection method | |
WO2018165816A1 | Chip fanning out circuit and method | |
WO2018165815A1 | Chip fanning out method | |
WO2018098647A1 | Integrated circuit multichip stacked packaging structure and method | |
CN110024113A | Integrated circuit package structure and method | |
CN110024107A | Integrated circuit packaging method and integration packaging circuit | |
US2020043886A1 | Integrated Circuit Packaging Method and Integrated Packaging Circuit | |
CN109997222A | IC system and packaging method |