| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 14 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Micro-structure and nano-technology | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Making microstructural devices | |
| #3 | Microstructural devices | |
| #4 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chia-Ming Cheng | 3 |
| #2 | Jianhong Liu | 3 |
| #3 | Chang Shu-Ming | 2 |
| #4 | Long-Sheng Yeou | 2 |
| #5 | Liu Tsang-Yu | 2 |
| #6 | Yu-Lin Yen | 2 |
| #7 | Tsang-Yu Liu | 2 |
| #8 | Chuan-Jin Shiu | 1 |
| #9 | Huang Tien-Hao | 1 |
| #10 | Wenzheng Qian | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN101369591A | Image sensing element packaging body and preparation thereof | |
| CN101236945A | Electronic part with electromagnetic interference shielding action and its encapsulation method | |
| CN101236938A | Heat radiation method and structure of chip package module | |
| CN101236978A | Sensitized chip encapsulation structure and its making method |