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INVENSAS BONDING TECH INC

Overview
  • Total Patents
    176
  • GoodIP Patent Rank
    8,250
  • Filing trend
    ⇧ 20.0%
About

INVENSAS BONDING TECH INC has a total of 176 patent applications. It increased the IP activity by 20.0%. Its first patent ever was published in 2014. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and audio-visual technology are INVENSAS BONDING TECHNOLOGIES INC, CHINA WAFER LEVEL CSP LTD and VISWANADAM GAUTHAM.

Patent filings per year

Chart showing INVENSAS BONDING TECH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Uzoh Cyprian Emeka 78
#2 Katkar Rajesh 73
#3 Gao Guilian 57
#4 Mirkarimi Laura Wills 44
#5 Fountain Jr Gaius Gillman 40
#6 Delacruz Javier A 40
#7 Haba Belgacem 38
#8 Wang Liang 34
#9 Huang Shaowu 29
#10 Enquist Paul M 28

Latest patents

Publication Filing date Title
US2020411483A1 Direct bonded stack structures for increased reliability and improved yield in microelectronics
US2020371154A1 Security circuitry for bonded structures
US2021098412A1 Direct gang bonding methods and structures
WO2020219297A1 Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
US2020328165A1 Wafer-level bonding of obstructive elements
US2020328162A1 Protective elements for bonded structures
US2020328164A1 Protective elements for bonded structures
US2020395321A1 Sealed bonded structures and methods for forming the same
WO2020150159A1 Bonded structures
US2020194396A1 Method and structures for low temperature device bonding
US2020126906A1 Interconnect structures
US2020051937A1 Low temperature bonded structures
US2020075520A1 Bond enhancement in microelectronics by trapping contaminants and arresting cracks during direct-bonding processes
US2020035641A1 Post cmp processing for hybrid bonding
WO2020010265A1 Microelectronic assemblies
US2020013754A1 Molded direct bonded and interconnected stack
WO2020010056A1 Techniques for joining dissimilar materials in microelectronics
WO2019241367A1 Interlayer connection of stacked microelectronic components
US2019385935A1 Tsv as pad
US2019385966A1 Large metal pads over tsv