| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 31 | |
| #2 | United States | 1 |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Making microstructural devices | |
| #3 | Microstructural devices | |
| #4 | Casings and printed circuits | |
| #5 | Resonators | |
| #6 | Capacitors and switching devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Uzoh Cyprian Emeka | 16 |
| #2 | Katkar Rajesh | 13 |
| #3 | Gao Guilian | 12 |
| #4 | Fountain Jr | 9 |
| #5 | Mirkarimi Laura Wills | 9 |
| #6 | Haba Belgacem | 8 |
| #7 | Delacruz Javier A | 8 |
| #8 | Enquist Paul M | 6 |
| #9 | Huang Shaowu | 6 |
| #10 | Wang Liang | 5 |
| Publication | Filing date | Title |
|---|---|---|
| TW202046417A | Interlayer connection of stacked microelectronic components |