VISWANADAM GAUTHAM has a total of 14 patent applications. Its first patent ever was published in 2001. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Singapore. Its main competitors in its focus markets semiconductors and micro-structure and nano-technology are CHINA WAFER LEVEL CSP LTD, INVENSAS BONDING TECHNOLOGIES INC and INVENSAS BONDING TECH INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 4 | |
#2 | WIPO (World Intellectual Property Organization) | 4 | |
#3 | Singapore | 3 | |
#4 | Australia | 1 | |
#5 | China | 1 | |
#6 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Making microstructural devices | |
#3 | Microstructural devices |
# | Name | Total Patents |
---|---|---|
#1 | Viswanadam Gautham | 12 |
#2 | Gautham Viswanadam | 2 |
Publication | Filing date | Title |
---|---|---|
US2011318852A1 | Wafer level integration module having controlled resistivity interconnects | |
CN103460336A | Micro-device on glass | |
SG156550A1 | Wafer level integration module with interconnects | |
US2010144093A1 | Integrated circuit device and method of manufacturing thereof | |
AU2003217142A1 | Integrated circuit device and method of manufacturing thereof | |
SG111922A1 | Wafer level package for semiconductor devices | |
SG105519A1 | Substrate level 3d package for semiconductor devices |