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CHINA WAFER LEVEL CSP LTD

Overview
  • Total Patents
    18
About

CHINA WAFER LEVEL CSP LTD has a total of 18 patent applications. Its first patent ever was published in 2006. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors and micro-structure and nano-technology are VISWANADAM GAUTHAM, INVENSAS BONDING TECHNOLOGIES INC and INVENSAS BONDING TECH INC.

Patent filings in countries

World map showing CHINA WAFER LEVEL CSP LTDs patent filings in countries
# Country Total Patents
#1 China 10
#2 United States 8

Patent filings per year

Chart showing CHINA WAFER LEVEL CSP LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Guoqing Yu 10
#2 Wei Wang 10
#3 Qiuhong Zou 9
#4 Wang Wei 8
#5 Yu Guoqing 8
#6 Zhiqi Wang 7
#7 Xu Qinqin 4
#8 Youjun Wang 4
#9 Zou Qiuhong 3
#10 Wang Youjun 3

Latest patents

Publication Filing date Title
CN102024897A Wafer-level package structure of light emitting diode and manufacturing method thereof
CN101807560A Packaging structure of semiconductor device and manufacture method thereof
CN101789414A Ultrathin semiconductor chip packaging structure and manufacturing process thereof
CN101699622A Packaging structure and packaging method of semiconductor device
CN101593733A Encapsulation structure
CN101488476A Encapsulation method
US2010044857A1 WLCSP target and method for forming the same
CN101477982A Photoconverter, manufacturing process thereof, and LED
CN101419952A Wafer stage chip encapsulation method and encapsulation construction
CN101369568A Packaging structure, packaging method and photosensitive device
US2009102056A1 Patterned Leads For WLCSP And Method For Fabricating The Same
US2009057868A1 Wafer level chip size package for MEMS devices and method for fabricating the same
CN101355066A Packaging structure and manufacturing method thereof
US2008111223A1 Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same
US2008111228A1 Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same