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HUATIAN TECHNOLOGY KUNSHAN ELECTRONICS CO LTD

Overview
  • Total Patents
    33
  • GoodIP Patent Rank
    48,757
About

HUATIAN TECHNOLOGY KUNSHAN ELECTRONICS CO LTD has a total of 33 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China and Taiwan. Its main competitors in its focus markets semiconductors, optics and micro-structure and nano-technology are INVENSAS BONDING TECH INC, CHINA WAFER LEVEL CSP LTD and XINTEC INC.

Patent filings in countries

World map showing HUATIAN TECHNOLOGY KUNSHAN ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 32
#2 Taiwan 1

Patent filings per year

Chart showing HUATIAN TECHNOLOGY KUNSHAN ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhai Lingling 26
#2 Wan Lixi 24
#3 Qian Jingxian 24
#4 Huang Xiaohua 22
#5 Wang Yeye 18
#6 Shen Jianshu 18
#7 Fan Jun 9
#8 Xiao Zhiyi 6
#9 Jin Kai 4
#10 Ma Li 4

Latest patents

Publication Filing date Title
CN105355641A Packaging structure and packaging method of high-pixel image sensing chip
CN105244308A Method for holding thin wafer through temporary bonding of porous slide glass
CN105236346A MEMS chip packaging structure and manufacturing method thereof
CN105347292A Micro-electro-mechanical-systems (MEMS) capsulation structure capable of relieving cover plate stress and capsulation method thereof
CN105347291A Packaging structure for transferring chip bonding stress and production method thereof
CN105047605A Semiconductor packaging structure and manufacturing method thereof
CN105070667A Image sensor chip packaging method
CN105097861A Wafer-level packaging method for image sensor
CN105023900A Embedded silicon substrate fan-out type packaging structure and manufacturing method thereof
TW201633414A Methods for forming pillar bumps on semiconductor wafers
CN104953013A Fluorescent glass fiber board
CN104979447A Flip LED packaging structure and manufacturing method
CN104900619A Wafer-level chip encapsulation structure and manufacturing method thereof
CN104780307A Array lens imaging system and clear imaging method for high-speed moving object with the same
CN104795436A Wafer packaging structure, chip packaging structure and packaging method thereof
CN104752384A Semiconductor encapsulating structure and making method thereof
CN104851852A Packaging structure of fingerprint identification chip and manufacture method
CN104637878A Ultra-narrow-pitch wafer level encapsulation cutting method
CN104538416A High-reliability fully-closed CMOS image sensor structure and production method thereof
CN104600058A Multi-chip semiconductor package structure and manufacturing method