| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 4 | |
| #2 | China | 2 | |
| #3 | Taiwan | 2 | |
| #4 | United States | 2 | |
| #5 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Micro-structure and nano-technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Making microstructural devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Priewasser Karl Heinz | 11 |
| Publication | Filing date | Title |
|---|---|---|
| CN108140609A | Handle the method for wafer and with protection sheet material in the method | |
| WO2016107630A1 | Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing method |