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VERTICAL CIRCUITS INC

Overview
  • Total Patents
    71
About

VERTICAL CIRCUITS INC has a total of 71 patent applications. Its first patent ever was published in 1995. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and Republic of Korea. Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are ZYCUBE KK, YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD and SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD.

Patent filings per year

Chart showing VERTICAL CIRCUITS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mcelrea Simon J S 34
#2 Mcgrath Scott 24
#3 Robinson Marc E 18
#4 Caskey Terrence 18
#5 Leal Jeffrey S 13
#6 Vindasius Al 13
#7 Robinson Marc 12
#8 Du Yong 12
#9 Andrews Lawrence Douglas 11
#10 Co Reynaldo 8

Latest patents

Publication Filing date Title
WO2011056668A2 Selective die electrical insulation additive process
CN102473697A Electrical interconnect for die stacked in zig-zag configuration
US2011115099A1 Flip-chip underfill
US2010117224A1 Sensor
US2010140811A1 Semiconductor die interconnect formed by aerosol application of electrically conductive material
TW201015707A Image sensor
CN101999167A Support mounted electrically interconnected die assembly
US2009315174A1 Semiconductor die separation method
US2009102038A1 Chip scale stacked die package
US2009206458A1 Flat leadless packages and stacked leadless package assemblies
WO2009035849A2 Semiconductor die mount by conformal die coating
WO2009026171A2 Stacked die vertical interconnect formed by transfer of interconnect material
TW200917391A Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
WO2008157722A1 Wafer level surface passivation of stackable integrated circuit chips
WO2008154580A2 Method for optimized integrated circuit chip interconnection
WO2008154582A2 Semiconductor die coating and interconnection fixture and method
KR20100020518A Electrically interconnected stacked die assemblies
US2009068790A1 Electrical Interconnect Formed by Pulsed Dispense
WO2008115744A1 Vertical electrical interconnect formed on support prior to die mount
US2005258530A1 Micropede stacked die component assembly