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WALSIN ADVANCED ELECTRONICS

Overview
  • Total Patents
    54
About

WALSIN ADVANCED ELECTRONICS has a total of 54 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Taiwan, United States and Republic of Korea. Its main competitors in its focus markets semiconductors, audio-visual technology and environmental technology are ZYCUBE KK, OHKUCHI MATERIALS CO LTD and TOPACIO RODEN R.

Patent filings in countries

World map showing WALSIN ADVANCED ELECTRONICSs patent filings in countries
# Country Total Patents
#1 Taiwan 28
#2 United States 22
#3 Republic of Korea 3
#4 Japan 1

Patent filings per year

Chart showing WALSIN ADVANCED ELECTRONICSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liou Wen-Jiun 12
#2 Su Spencer 11
#3 Lai James 11
#4 Liu Wen-Chun 11
#5 Liou Jung-Jie 8
#6 Lin Chien-Tsun 7
#7 Chen Allen 6
#8 Chien-Tsun Lin 6
#9 Chao-Chia Chang 6
#10 Lai Chien-Hung 6

Latest patents

Publication Filing date Title
TW530344B Conductive ball for electrical connection and applications thereof
TW536764B Method for multi-chip package and structure thereof
US6762118B2 Package having array of metal pegs linked by printed circuit lines
US2003100174A1 Process for making a ball grid array semiconductor package
TW504818B Multi-chip package
TW518732B A semiconductor packaging process for ball grid array (BGA)
US6486564B2 Heat dissipation module for a BGA IC
US2003006055A1 Semiconductor package for fixed surface mounting
US6385049B1 Multi-board BGA package
US2003001250A1 TCP optical device
TW484237B An optical device with a tape packaging type
TW483134B Micro BGA package
TW484218B A build packaging method
TW498511B A multi-board BGA package comprises
US2002182773A1 Method for bonding inner leads of leadframe to substrate
US2002173074A1 Method for underfilling bonding gap between flip-chip and circuit substrate
US6437429B1 Semiconductor package with metal pads
TW484223B Lead on chip package and its manufacturing process
TW480695B Method of bonding lead fingers of a lead frame and a substrate
US6459162B1 Encapsulated semiconductor die package, and method for making same