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MEYER THORSTEN

Overview
  • Total Patents
    44
  • GoodIP Patent Rank
    219,725
About

MEYER THORSTEN has a total of 44 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and control are YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD, SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD and ZYCUBE KK.

Patent filings in countries

World map showing MEYER THORSTENs patent filings in countries
# Country Total Patents
#1 United States 44

Patent filings per year

Chart showing MEYER THORSTENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Meyer Thorsten 44
#2 Brunnbauer Markus 11
#3 Ofner Gerald 8
#4 Waidhas Bernd 5
#5 Sezi Recai 4
#6 Sommer Grit 4
#7 Pohl Jens 3
#8 Wolter Andreas 2
#9 Hess Reinhard 2
#10 Ort Thomas 2

Latest patents

Publication Filing date Title
US2014264831A1 Chip arrangement and a method for manufacturing a chip arrangement
US2014197530A1 Semiconductor device with chip having low-k-layers
US8729714B1 Flip-chip wafer level package and methods thereof
US2014159856A1 Sensor hierarchy
US2014151700A1 Chip package and a method for manufacturing a chip package
US2014027773A1 Semiconductor device including a diode and method of manufacturing a semiconductor device
US2014015131A1 Stacked fan-out semiconductor chip
US2013342263A1 Heater for semiconductor device
US2013328191A1 Cte adaption in a semiconductor package
US2013256883A1 Rotated semiconductor device fan-out wafer level packages and methods of manufacturing rotated semiconductor device fan-out wafer level packages
US2013256884A1 Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
US2013175686A1 Enhanced flip chip package
US2013049205A1 Chip with encapsulated sides and exposed surface
US2012273957A1 Chip-packaging module for a chip and a method for forming a chip-packaging module
US2012161278A1 Method and system for providing fusing after packaging of semiconductor devices
US2012146231A1 Semiconductor device and method of manufacture thereof
US2012098083A1 Integrated circuit technology with different device epitaxial layers
US2012049375A1 Method and system for routing electrical connections of semiconductor chips
US2011241218A1 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
US2011204513A1 Device including an encapsulated semiconductor chip and manufacturing method thereof