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KR101061531B1
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Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
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KR101059490B1
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Conductive pads defined by embedded traces
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Microelectronic assembly with joined bond elements having lowered inductance
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KR101003393B1
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Microelectronic assembly with joined bond elements having lowered inductance
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Microelectronic assembly with bond elements having lowered inductance
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Microelectronic assembly with impedance controlled wirebond and conductive reference element
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KR100935854B1
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Microelectronic assembly with impedance controlled wirebond and reference wirebond
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KR20110027690A
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Stacking of wafer-level chip scale packages having edge contacts
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