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ADVANCED CHIP ENG TECH INC

Overview
  • Total Patents
    454
About

ADVANCED CHIP ENG TECH INC has a total of 454 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are MEGICA CORP, MEYER-BERG GEORG and DO BYUNG TAI.

Patent filings in countries

World map showing ADVANCED CHIP ENG TECH INCs patent filings in countries
# Country Total Patents
#1 United States 98
#2 Taiwan 85
#3 China 67
#4 Germany 52
#5 Japan 51
#6 Singapore 51
#7 Republic of Korea 50

Patent filings per year

Chart showing ADVANCED CHIP ENG TECH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Wen-Kun 274
#2 Chang Jui-Hsien 95
#3 Yang Wen Kun 75
#4 Hsu Hsien-Wen 62
#5 Lin Diann-Fang 58
#6 Lin Chih-Wei 41
#7 Wang Tung-Chuan 35
#8 Chou Chao-Nan 28
#9 Sun Wen-Bin 26
#10 Chang Jui Hsien 25

Latest patents

Publication Filing date Title
US2011209908A1 Conductor package structure and method of the same
TW201131705A Conductor package structure and method of the same
US2011180891A1 Conductor package structure and method of the same
US2011031594A1 Conductor package structure and method of the same
US2011031607A1 Conductor package structure and method of the same
CN101740551A Laminated die package structure for semiconductor element and method thereof
US2010109156A1 Back side protective structure for a semiconductor package
CN101728368A Semiconductor assembly packaging structure with a plurality of grains and packaging method thereof
TW200931606A Semiconductor device package having a back side protective scheme
TW200933844A Wafer level package with die receiving through-hole and method of the same
TW200921889A Package on package structure for semiconductor devices and method of the same
TW201011877A Method for forming metal line and ubm in wafer level package
US2010007017A1 Inter-connecting structure for semiconductor package and method for the same
US2009321915A1 System-in-package and manufacturing method of the same
TW200837902A Image sensor module having build-in package cavity and the method of the same
US2009212428A1 Re-distribution conductive line structure and the method of forming the same
US2009184425A1 Conductive line structure and the method of forming the same
CN101471313A Stereo electronic packaging structure containing conduction support base material
US2009166873A1 Inter-connecting structure for semiconductor device package and method of the same
KR20090066653A 3d electronic packaging structure having a conductive support substrate