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SANDISK SEMICONDUCTOR SHANGHAI CO LTD

Overview
  • Total Patents
    83
  • GoodIP Patent Rank
    77,149
  • Filing trend
    ⇩ 37.0%
About

SANDISK SEMICONDUCTOR SHANGHAI CO LTD has a total of 83 patent applications. It decreased the IP activity by 37.0%. Its first patent ever was published in 2010. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are OTREMBA RALF, ADVANPACK SOLUTIONS PTE LTD and TESSERA RESEARCH LLC.

Patent filings per year

Chart showing SANDISK SEMICONDUCTOR SHANGHAI CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yu Cheeman 38
#2 Lu Zhong 37
#3 Chiu Chin Tien 25
#4 Takiar Hem 24
#5 Chiu Chin-Tien 19
#6 Fu Peng 14
#7 Yu Fen 13
#8 Tai Enyong 13
#9 Wang Li 12
#10 Xiao Fuqiang 10

Latest patents

Publication Filing date Title
CN110391218A The semiconductor device of control is tilted with naked core
US2018190621A1 Semiconductor device including dual pad wire bond interconnection
CN109950223A Semiconductor device comprising double pad wire bonding interconnection
CN109103167A Isomerism fan-out structure for memory device
CN108878398A Semiconductor devices including conductive bump interconnection
CN108206169A Included in the semiconductor device of the naked core joint sheet of naked core edge
CN107305861A Semiconductor device and its manufacture method
JP2015146418A Discrete component backward traceability and semiconductor device forward traceability
CN104752380A Semiconductor device
CN104752491A Spacer layer for semiconductor device and semiconductor device
CN104078081A Method and device for testing semiconductor device without scratching interface contact fingers
KR20180050436A Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
WO2014032228A1 Bridge ball wire bonding
CN104603923A Semiconductor die laminating device with independent drives
CN103238213A Tilt bare chip stack body
CN107481947A For the epoxy coating in the substrate of naked core installation
WO2013049965A1 Dragonfly wire bonding
EP2577727A1 Method for forming color images on memory devices
WO2013007029A1 Chip-on-package structure for multiple die stacks
CN103098170A Dies prepeeling apparatus and method