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TIANSHUI HUATIAN TECHNOLOGY CO

Overview
  • Total Patents
    60
  • GoodIP Patent Rank
    151,528
About

TIANSHUI HUATIAN TECHNOLOGY CO has a total of 60 patent applications. Its first patent ever was published in 2008. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and micro-structure and nano-technology are PAGAILA REZA ARGENTY, LIN YAOJIAN and TERAMIKROS INC.

Patent filings in countries

World map showing TIANSHUI HUATIAN TECHNOLOGY COs patent filings in countries
# Country Total Patents
#1 China 53
#2 WIPO (World Intellectual Property Organization) 6
#3 United States 1

Patent filings per year

Chart showing TIANSHUI HUATIAN TECHNOLOGY COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Xizhou 31
#2 Mu Yu 28
#3 Guo Xiaowei 27
#4 Mu Wei 20
#5 Zhu Wenhui 14
#6 Shao Rongchang 14
#7 He Wenhai 9
#8 Xiaowei Guo 7
#9 Wang Yongzhong 7
#10 Zhang Yile 7

Latest patents

Publication Filing date Title
CN105161475A Leadless chip scale package (CSP) stack packaging part with double circles of solder bumps and manufacturing method of leadless CSP stack packaging part
CN105023922A Heat sink structure double-carrier LED drive circuit package and manufacturing method thereof
CN104900624A System-level MEMS dual-carrier chip encapsulation component and production method thereof
CN104934405A Lead wire framework based on DIP multiple substrates and method of using lead wire framework to manufacture packaging part
CN104517949A HV-COB LED light source based on remote phosphor powder excitation
CN104465595A CSP type MEMS packaging piece based on customized lead frame and production method
CN104332550A COB type LED packing piece based on beryllium oxide ceramic substrate and production method
CN104201156A Substrate based bumped flip chip CSP (Chip Scale Package) package part, substrate and manufacturing method
CN104124216A Substrate chip carrier CSP package and production method thereof
CN104070676A Circular ring adhesion mold capable of improving production efficiency and circular ring adhesion method
CN103730442A Area array quad flat no lead package (AAQFN) package body package in package (PiP) piece with solder balls and production method
CN103730443A Area array quad flat no lead package (AAQFN) IC chip package in package (PiP) piece with solder balls and production method
CN104752386A High reliability small outline package (SOP) lead frame and production method of packaging piece
CN103675664A Detecting device and method for tester relay control bit
CN103594447A IC chip stack packaged component large in packaging density and good in high frequency performance and manufacturing method thereof
CN103594380A Manufacturing method for flat-four-side and non-pin package part with soldered ball surface array
CN103579012A Method for producing AAQFN packaging piece provided with solder ball face
CN103515250A Production method of 75-micron ultrathin chips
CN103515316A Production method of 50-micron ultrathin chips
CN103337483A Ultrathin VSOP (very thin small outline package) packaging part and production method thereof