|
US2014063766A1
|
|
Lateral element isolation device
|
|
US2014061669A1
|
|
Chip package and a method for manufacturing a chip package
|
|
US2014008702A1
|
|
Semiconductor packages having multiple lead frames and methods of formation thereof
|
|
US2014001480A1
|
|
Lead Frame Packages and Methods of Formation Thereof
|
|
US2014001615A1
|
|
Package-in-packages and methods of formation thereof
|
|
US2013341777A1
|
|
Electro-thermal cooling devices and methods of fabrication thereof
|
|
US2013334677A1
|
|
Semiconductor modules and methods of formation thereof
|
|
US2013313712A1
|
|
Multi-chip package and method of manufacturing thereof
|
|
US2013285197A1
|
|
Semiconductor Devices and Methods of Manufacturing and Using Thereof
|
|
US2013229777A1
|
|
Chip arrangements and methods for forming a chip arrangement
|
|
US2013200532A1
|
|
Semiconductor device using diffusion soldering
|
|
US2013161801A1
|
|
Module including a discrete device mounted on a DCB substrate
|
|
US2013146991A1
|
|
Device including two power semiconductor chips and manufacturing thereof
|
|
US2013069243A1
|
|
Chip module and method for fabricating a chip module
|
|
US2013056877A1
|
|
Chip-housing module and a method for forming a chip-housing module
|
|
US2013027113A1
|
|
Power semiconductor chip having two metal layers on one face
|
|
US2013009295A1
|
|
Semiconductor device including a contact clip having protrusions and manufacturing thereof
|
|
US2012235227A1
|
|
Power semiconductor device
|
|
US2012068186A1
|
|
Electronic device comprising a chip disposed on a pin
|
|
US2012061812A1
|
|
Power semiconductor chip package
|
