US2013009297A1
|
|
Semiconductor device package having configurable lead frame fingers
|
US2013009296A1
|
|
Semiconductor device package having features formed by stamping
|
US2013017652A1
|
|
Method of manufacturing a semiconductor device package with a heatsink
|
US2009250796A1
|
|
Semiconductor device package having features formed by stamping
|
US2009283919A1
|
|
Semiconductor package featuring flip-chip die sandwiched between metal layers
|
US2009273065A1
|
|
Interconnection of lead frame to die utilizing flip chip process
|
JP2009131144A
|
|
Bidirectional reverse blocking battery switch
|
CN101068005A
|
|
Semiconductor device package leadframe formed from multiple metal layers
|
US2008135991A1
|
|
Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
|
US2008111219A1
|
|
Package designs for vertical conduction die
|
US2007130759A1
|
|
Semiconductor device package leadframe formed from multiple metal layers
|
US2005255634A1
|
|
Chemical-enhanced package singulation process
|
US7122406B1
|
|
Semiconductor device package diepad having features formed by electroplating
|
CN1735958A
|
|
Space-efficient package for laterally conducting device
|
US2004173881A1
|
|
Space-efficient package for laterally conducting device
|
US7057273B2
|
|
Surface mount package
|