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GEM SERVICES INC

Overview
  • Total Patents
    39
About

GEM SERVICES INC has a total of 39 patent applications. Its first patent ever was published in 2001. It filed its patents most often in United States, China and Japan. Its main competitors in its focus markets semiconductors, environmental technology and audio-visual technology are MEYER-BERG GEORG, DO BYUNG TAI and MEGICA CORP.

Patent filings in countries

World map showing GEM SERVICES INCs patent filings in countries

Patent filings per year

Chart showing GEM SERVICES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chia Anthony 27
#2 Harnden James 17
#3 Tsui Anthony C 16
#4 Yang Hongbo 12
#5 Williams Richard K 12
#6 Weibing Chu 9
#7 Anthony Chia 6
#8 Lam Allen K 5
#9 Zeng Xiaoguang 5
#10 Wong Liming 5

Latest patents

Publication Filing date Title
US2013009297A1 Semiconductor device package having configurable lead frame fingers
US2013009296A1 Semiconductor device package having features formed by stamping
US2013017652A1 Method of manufacturing a semiconductor device package with a heatsink
US2009250796A1 Semiconductor device package having features formed by stamping
US2009283919A1 Semiconductor package featuring flip-chip die sandwiched between metal layers
US2009273065A1 Interconnection of lead frame to die utilizing flip chip process
JP2009131144A Bidirectional reverse blocking battery switch
CN101068005A Semiconductor device package leadframe formed from multiple metal layers
US2008135991A1 Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
US2008111219A1 Package designs for vertical conduction die
US2007130759A1 Semiconductor device package leadframe formed from multiple metal layers
US2005255634A1 Chemical-enhanced package singulation process
US7122406B1 Semiconductor device package diepad having features formed by electroplating
CN1735958A Space-efficient package for laterally conducting device
US2004173881A1 Space-efficient package for laterally conducting device
US7057273B2 Surface mount package