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STS SC & TELECOMM CO LTD

Overview
  • Total Patents
    204
  • GoodIP Patent Rank
    40,011
About

STS SC & TELECOMM CO LTD has a total of 204 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, United States and Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and computer technology are BARTH HANS-JOACHIM, AMKOR TECHNOLOGY INC and CHIPMOS TECHNOLOGIES BERMUDA.

Patent filings in countries

World map showing STS SC & TELECOMM CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 182
#2 United States 15
#3 Japan 4
#4 Taiwan 2
#5 China 1

Patent filings per year

Chart showing STS SC & TELECOMM CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hwang Sun Ha 16
#2 Kim Hee Cheol 15
#3 Chun Jung Hwan 14
#4 Son Jong Myoung 13
#5 Lee Seung Tae 10
#6 Park Min Suh 10
#7 Boo Kyung Teck 9
#8 Jung Hyun Hak 9
#9 Jeong Sang Jin 8
#10 Oh Seung Hoon 8

Latest patents

Publication Filing date Title
US2017092510A1 Wafer level fan-out package and method for manufacturing the same
US2016365324A1 Method of manufacturing wafer level packaging including through encapsulation vias
KR101582985B1 soldering method and soldering device of solder ball having a flux layer
KR101573274B1 Semiconductor die bonding apparatus and method of bonding stage alignment thereof
KR20160042606A Optical system comprising ir light and apparatus for bonding die using the same
KR20160042605A Method for manufacturing stacked semiconductor package
KR101582984B1 Die bonding appartus of semiconductor and method thereof
KR20160034655A Wire bonding structure and method thereof
KR20140141536A cutting method of wafer for stacked semiconductor package
KR101562746B1 Windower clamp for wire bonder and method for wire bonding using thereof
KR20160028116A processing method of echting hole and manufacturing method of stacked semiconductor package
KR20160023970A Semiconductor package form-die and coating method thereof
KR20160023969A Stacked semiconductor package, wire bonding method of stacked semiconductor package and manufacturing method thereof
KR20160023121A Semiconductor manufacturing apparatus
KR101575490B1 Stacked package and method for manufacturing the same
KR20150143053A Air blow apparatus for wire bonding
KR101576372B1 Downset apparatus for lead frame
KR20150142497A Semiconductor package and method for manufacturing the same
KR20150142915A Semiconductor package and method for manufacturing the same
KR20150142911A Semiconductor package and method for manufacturing the same