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YAP WENG F

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    202,402
About

YAP WENG F has a total of 11 patent applications. Its first patent ever was published in 2013. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and machine tools are AMKOR TECHNOLOGY INC, CHOW SENG GUAN and WUXI CHINA RESOURCES MICRO ASSEMBLY TECH CO LTD.

Patent filings in countries

World map showing YAP WENG Fs patent filings in countries
# Country Total Patents
#1 United States 11

Patent filings per year

Chart showing YAP WENG Fs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yap Weng F 11
#2 Magnus Alan J 3
#3 Vincent Michael B 2
#4 Pabst Eduard J 1
#5 Law Lai Cheng 1
#6 Wright Jason R 1
#7 Gong Zhiwei 1
#8 Hayes Scott M 1
#9 Wong Boh Kid 1

Latest patents

Publication Filing date Title
US2016064341A1 Microelectronic packages having texturized solder pads and methods for the fabrication thereof
US2015371960A1 System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof
US2015333028A1 Wafer level packages having non-wettable solder collars and methods for the fabrication thereof
US2015262981A1 Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
US2015145108A1 Methods for the production of microelectronic packages having radiofrequency stand-off layers
US2015137381A1 Optically-masked microelectronic packages and methods for the fabrication thereof
US2015061139A1 Microelectronic packages containing opposing devices and methods for the fabrication thereof
US2014353840A1 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
US2014264945A1 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
US2014239497A1 Packaged semiconductor device
US8741666B1 Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires