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AMKOR TECHNOLOGY INC

Overview
  • Total Patents
    2,729
  • GoodIP Patent Rank
    2,026
  • Filing trend
    ⇩ 50.0%
About

AMKOR TECHNOLOGY INC has a total of 2,729 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 1991. It filed its patents most often in Republic of Korea, United States and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are BARTH HANS-JOACHIM, WALSIN ADVANCED ELECTRONICS and CHOW SENG GUAN.

Patent filings per year

Chart showing AMKOR TECHNOLOGY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Byong Jin 187
#2 Glenn Thomas P 166
#3 Paek Jong Sik 127
#4 Huemoeller Ronald Patrick 111
#5 Park Doo Hyun 92
#6 Do Won Chul 90
#7 Webster Steven 90
#8 Shin Won Seon 83
#9 Chung Ji Young 77
#10 Kim Gi Jeong 76

Latest patents

Publication Filing date Title
JP2020174220A Semiconductor package
JP2020141152A Semiconductor assembly and manufacturing method of the same
JP2020065088A Semiconductor device and method for manufacturing the same
CN111293112A Semiconductor package and method of manufacturing the same
US2021043606A1 Semiconductor devices and methods of manufacturing semiconductor devices
US2021005563A1 Semiconductor devices and methods of manufacturing semiconductor devices
US2020402885A1 Semiconductor device and method of manufacturing a semiconductor device
US2020399119A1 Semiconductor device and method of manufacturing semiconductor device
US2020402830A1 Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
US2019287818A1 Encapsulated semiconductor package
US2020373247A1 Semiconductor device and method of manufacturing semiconductor device
US2019326161A1 Semiconductor device package and manufacturing method thereof
US10644479B1 Semiconductor device and method of manufacturing a semiconductor device
TW201933498A Semiconductor package and manufacturing method thereof
US2020194542A1 Semiconductor device and method of manufacturing a semiconductor device
US2019115319A1 Semiconductor package and fabricating method thereof
US2019057941A1 Integrated shield package and method
US2020083186A1 Semiconductor device with improved thermal dissipation and manufacturing methods
US2019318994A1 Semiconductor package using cavity substrate and manufacturing methods
US2019304916A1 Embedded ball land substrate, semiconductor package, and manufacturing methods