| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 11 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Computer technology | |
| #4 | Machine tools | |
| #5 | Materials and metallurgy | |
| #6 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Elenius Peter | 4 |
| #2 | Curtis Anthony | 3 |
| #3 | Burgess Guy F | 3 |
| #4 | Johnson Michael E | 3 |
| #5 | Strothmann Thomas | 2 |
| #6 | Hollack Harry | 2 |
| #7 | Yu Yuan | 1 |
| #8 | Tessier Ted | 1 |
| #9 | Alvarado Reynante | 1 |
| #10 | Vrtis Joan K | 1 |
| Publication | Filing date | Title |
|---|---|---|
| EP2449582A2 | Methods and structures for a vertical pillar interconnect | |
| EP2316129A2 | Enhanced reliability for semiconductor devices using dielectric encasement | |
| EP1815515A2 | Semiconductor device package with bump overlying a polymer layer |