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CHOW SENG GUAN

Overview
  • Total Patents
    30
About

CHOW SENG GUAN has a total of 30 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are TOPACIO RODEN R, PENDSE RAJENDRA D and PHOENIX PREC TECHNOLOGY.

Patent filings in countries

World map showing CHOW SENG GUANs patent filings in countries
# Country Total Patents
#1 United States 30

Patent filings per year

Chart showing CHOW SENG GUANs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chow Seng Guan 30
#2 Kuan Heap Hoe 18
#3 Huang Rui 8
#4 Shim Il Kwon 7
#5 Chua Linda Pei Ee 5
#6 Han Byung Joon 4
#7 Dimaano Jr Antonio B 3
#8 Pagaila Reza Argenty 3
#9 Ying Ming 2
#10 Do Byung Tai 2

Latest patents

Publication Filing date Title
US2012306038A1 Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
US2012139120A1 Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package
US2012061854A1 Integrated circuit packaging system with package-on-package and method of manufacture thereof
US2010289134A1 Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof
US2011214911A1 Circuit system with leads and method of manufacture thereof
US2011210436A1 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof
US2010123251A1 Integrated circuit packaging system with multi level contact and method of manufacture thereof
US2010102458A1 Semiconductor package system with cavity substrate and manufacturing method therefor
US2009315164A1 Integrated circuit package system with wire-in-film encapsulation
US2009309197A1 Integrated circuit package system with internal stacking module
US2008211084A1 Integrated circuit package system with interposer
US2009212442A1 Integrated circuit package system with penetrable film adhesive
US2009152692A1 Integrated circuit package system with offset stacking
US2009146269A1 Integrated circuit package system with shield
US2009140407A1 Integrated circuit package-on-package system with anti-mold flash feature
US2009115043A1 Mountable integrated circuit package system with mounting interconnects
US2008235941A1 Integrated circuit package system with mounting features for clearance
US2008157325A1 Integrated circuit package with molded cavity
US2008157318A1 Bridge stack integrated circuit package-on-package system
US2008142938A1 Integrated circuit package system employing a support structure with a recess