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ST ASSEMBLY TEST SERVICES LTD

Overview
  • Total Patents
    87
About

ST ASSEMBLY TEST SERVICES LTD has a total of 87 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, Singapore and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, measurement and machines are CHIPMOS TECHNOLOGIES BERMUDA, MEGIC CORP and AMKOR TECHNOLOGY INC.

Patent filings in countries

World map showing ST ASSEMBLY TEST SERVICES LTDs patent filings in countries
# Country Total Patents
#1 United States 50
#2 Singapore 36
#3 EPO (European Patent Office) 1

Patent filings per year

Chart showing ST ASSEMBLY TEST SERVICES LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shim Il Kwon 19
#2 Chow Seng Guan 12
#3 John Briar 8
#4 Han Byung Joon 8
#5 Ku Jae Hun 7
#6 Ararao Virgil Cotoco 7
#7 Punzalan Jeffrey D 7
#8 Ahn Byung Hoon 7
#9 Ramakrishna Kambhampati 6
#10 Briar John 6

Latest patents

Publication Filing date Title
US2005046015A1 Array-molded package heat spreader and fabrication method therefor
US2006027902A1 Method and apparatus for stacked die packaging
US2006012022A1 Integrated circuit die with pedestal
US2005277227A1 Chip scale package with open substrate
US2005258216A1 Packaging for optoelectronic devices
US2004253763A1 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
US2005260787A1 Dual row leadframe and fabrication method
US2005253262A1 Method of manufacturing different bond pads on the same substrate of an integrated circuit package
US2005242428A1 Heat spreader for thermally enhanced semiconductor package
US2005253230A1 Large die package structures and fabrication method therefor
US2005230800A1 Thermally enhanced stacked die package and fabrication method
US2004211817A1 System for fabricating an integrated circuit package on a printed circuit board
US2005173783A1 Semiconductor package with passive device integration
US2005161780A1 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
US7575956B2 Fabrication method for semiconductor package heat spreaders
US6858470B1 Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof
US2004145039A1 Stacked semiconductor packages and method for the fabrication thereof
US2004262718A1 Method of manufacturing a semiconductor package for a die larger than a die pad
US2004061204A1 Integrated circuit leadframe with ground plane
US2004061205A1 Moisture resistant integrated circuit leadframe package