| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 15 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Micro-structure and nano-technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Microstructural devices | |
| #3 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Wang Meng-Jen | 15 |
| #2 | Yang Kuo-Pin | 2 |
| #3 | Wu Chung-Hsi | 1 |
| #4 | Hsiao Wei-Min | 1 |
| #5 | Chen Chien-Yu | 1 |
| #6 | Peng Sheng-Yang | 1 |
| #7 | Wang Wei-Chung | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2010297843A1 | Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate | |
| US2011048788A1 | Method for forming a via in a substrate and substrate with a via |