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YU WAN-LING

Overview
  • Total Patents
    14
About

YU WAN-LING has a total of 14 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States, Taiwan and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are ZYCUBE KK, UNITED TEST & ASSEMBLY CT LT and YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD.

Patent filings in countries

World map showing YU WAN-LINGs patent filings in countries
# Country Total Patents
#1 United States 7
#2 Taiwan 6
#3 EPO (European Patent Office) 1

Patent filings per year

Chart showing YU WAN-LINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yu Wan-Ling 14

Latest patents

Publication Filing date Title
TW201526719A PCB structure with high heat conductivity
EP2615638A2 Semiconductor Package Structure and Method for Manufacturing The Same
US2013181341A1 Semiconductor package structure and method for manufacturing the same
TW201322381A Semiconductor packaging structure and manufacturing method thereof
TW201304201A Packaging method of light emitting or light receiving diode
TW201023278A Method for forming metallic bump on semiconductor component and sealing semiconductor component
US2010084763A1 Metallic bump structure without under bump metallurgy and manufacturing method thereof
TW200903675A Method of forming metallic bump in semiconductor and sealing
US2009098724A1 Method of forming metallic bump and seal for semiconductor device
US2009098723A1 Method of forming metallic bump on I/O pad
US2009080139A1 Structure of embedded capacitor
TW200904271A Capacitor structure embedded in printed circuit board