Learn more

XINTEX INC

Overview
  • Total Patents
    59
  • GoodIP Patent Rank
    30,874
  • Filing trend
    ⇩ 100.0%
About

XINTEX INC has a total of 59 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2010. It filed its patents most often in Taiwan. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and computer technology are XINTEC INC, CHEN MING-FA and TERAMIKROS INC.

Patent filings in countries

World map showing XINTEX INCs patent filings in countries
# Country Total Patents
#1 Taiwan 59

Patent filings per year

Chart showing XINTEX INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Tsang Yu 23
#2 Ho Yen Shih 19
#3 Huang Yu Lung 12
#4 Lin Chao Yen 9
#5 Liu Chien Hung 9
#6 Chang Shu Ming 8
#7 Suen Wei Luen 8
#8 Chen Chien Hui 8
#9 Wen Ying Nan 7
#10 Liao Chi Chang 6

Latest patents

Publication Filing date Title
TW202013632A Chip package and method for forming the same
TW201733056A Chip package and method for forming the same
TW201715662A Chip package and method for forming the same
TW201628172A Photosensitive module and method for forming the same
TW201628212A Photosensitive module and method for forming the same
TW201719805A Chip package and manufacturing method thereof
TW201631720A Chip package and method for forming the same
TW201543641A Chip package and method for forming the same
TW201537789A Chip package and method for forming the same
TW201532152A Chip package and method for forming the same
TW201532223A Chip package and method for forming the same
TW201624648A Chip package and method for forming the same
TW201539677A Chip package and method for forming the same
TW201508783A Inductor structure and manufacturing method thereof
TW201606888A Chip package and method thereof
TW201505141A Chip package and method for forming the same
TW201604970A Semiconductor structure and manufacturing thereof
TW201541586A Stacked chip package and method for forming the same
TW201539587A Method for forming chip package
TW201436142A Chip package and method for forming the same