|
TW523891B
|
|
Wafer level chip scale packaging structure and its manufacturing process
|
|
TW506097B
|
|
Wafer level chip scale package structure and its manufacturing method
|
|
JP2002299367A
|
|
Reproduction method of bump
|
|
KR20020091471A
|
|
Method of reworking bump
|
|
KR20020091470A
|
|
Method for forming bumps
|
|
KR20020091468A
|
|
Wafer-level packaging process
|
|
KR20020091469A
|
|
Wafer-level packaging
|
|
US6387795B1
|
|
Wafer-level packaging
|
|
TW483136B
|
|
Bump process
|
|
TW480685B
|
|
Wafer-level package process
|
|
US6443059B1
|
|
Solder screen printing process
|
|
KR20020071096A
|
|
Method of forming solder bumps
|
|
TW471146B
|
|
Bump fabrication method
|
|
JP2002158326A
|
|
Semiconductor device and manufacturing method thereof
|
|
TW441047B
|
|
Lead frame structure, lead frame packaging structure and the package testing method
|
|
KR20010001689A
|
|
A flip chip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method
|
|
US6258622B1
|
|
Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method
|
|
KR20000052098A
|
|
Semiconductor package with a stacked chip on a leadframe
|
|
KR20000052099A
|
|
Testing device and method for known good chip
|
|
TW437032B
|
|
Semiconductor package with stacking chips on the leadframe
|
