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Memory module in a package
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Memory module in a package
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Stackable microelectronic package structures
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Flip-chip, face-up and face-down centerbond memory wirebond assemblies
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Multiple die face-down stacking for two or more die
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Flip-chip, face-up and face-down wirebond combination package
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Cavities containing multi-wiring structures and devices
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Low CTE interposer
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Multiple die in a face down package
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Multi-chip module with stacked face-down connected dies
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Reinforced fan-out wafer-level package
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Interposer having molded low CTE dielectric
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Pin attachment
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Stacked microelectronic assembly having interposer connecting active chips
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No flow underfill
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Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
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Metal can impedance control structure
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Stacked multi-die packages with impedance control
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Impedance controlled packages with metal sheet or 2-layer RDL
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