SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD has a total of 23 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China, United States and Taiwan. Its main competitors in its focus markets semiconductors and machines are SIRINORAKUL SARAVUTH, BOBDE MADHUR and CHO NAMJU.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 6 | |
#2 | United States | 6 | |
#3 | Taiwan | 4 | |
#4 | WIPO (World Intellectual Property Organization) | 4 | |
#5 | Republic of Korea | 3 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Spraying devices | |
#3 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Chiu Chin Tien | 12 |
#2 | Yu Cheeman | 11 |
#3 | Kumar Shiv | 10 |
#4 | Lu Zhong | 10 |
#5 | Chiu Chin-Tien | 7 |
#6 | Takiar Hem | 6 |
#7 | Huang Dacheng | 5 |
#8 | Ji Zhongli | 5 |
#9 | Qian Kaiyou | 4 |
#10 | Gu Wei | 4 |
Publication | Filing date | Title |
---|---|---|
KR20160100142A | Die prepeeling apparatus and method | |
CN104733345A | Bare chip prestripping device and method | |
CN104681510A | Bridge structure for embedding semiconductor bare chips | |
CN103474421A | High-yield semiconductor device | |
US2015228621A1 | Semiconductor device including alternating stepped semiconductor die stacks | |
US2015214206A1 | Semiconductor device including embedded controller die and method of making same | |
WO2014063281A1 | Semiconductor device including stacked bumps for emi/rfi shielding | |
WO2014063287A1 | Wire tail connector for a semiconductor device |