GREAT TEAM BACKEND FOUNDRY INC innovation strategy

Patent filings in countries

#	Industry
#1	Semiconductors
#2	Audio-visual technology
#3	Micro-structure and nano-technology

#	Technology
#1	Semiconductor devices
#2	Casings and printed circuits
#3	Making microstructural devices

Publication	Filing date	Title
TW201312711A	2012-07-06	Pre molded can package
TW201308547A	2012-06-29	Molded can package
TW201238103A	2011-10-28	Chip package
TW201125172A	2010-08-30	Multi thickness lead frame
TW201133751A	2010-05-24	A mosfet of additional route and reduce resistance
TW201023306A	2009-11-30	Semiconductor device and manufacturing method thereof
TW201023305A	2009-10-09	Flip-chip package structure and the die attach method thereof
US2010102429A1	2009-01-23	Flip-chip package structure with block bumps and the wedge bonding method thereof
US2010123243A1	2009-01-23	Flip-chip chip-scale package structure
US2010072619A1	2009-01-23	Wire bonding structure and manufacturing method thereof