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ADVANCED INTERCONNECT TECH LTD

Overview
  • Total Patents
    89
About

ADVANCED INTERCONNECT TECH LTD has a total of 89 patent applications. Its first patent ever was published in 1990. It filed its patents most often in Taiwan, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are MEYER-BERG GEORG, CHI HEEJO and J DEVICES:KK.

Patent filings per year

Chart showing ADVANCED INTERCONNECT TECH LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Islam Shafidul 34
#2 San Antonio Romarico Santos 22
#3 Subagio Anang 20
#4 Lau Daniel K 19
#5 Juskey Frank J 12
#6 San Antonio Romarico S 9
#7 Karim Zaheed Sadrudin 9
#8 Shafidul Islam 8
#9 Santos San Antonio Romarico 7
#10 Mckerreghan Michael H 6

Latest patents

Publication Filing date Title
WO2007100642A2 No lead package with heat spreader
US2007052070A1 Die pad for semiconductor packages and methods of making and using same
KR20060121823A Reversible leadless package and methods of making and using same
CN101375382A Semiconductor device package and method for manufacturing same
WO2005000568A2 Lead frame device with vented die flag
CN1751390A Lead frame with included passive devices
KR20050100656A Thin multiple semiconductor die package
CN1748304A Thin multiple semiconductor die package
AU2003291199A8 Package having exposed integrated circuit device
CN1685498A Thermal enhanced package for block mold assembly
CN1777988A Taped lead frames and methods of making and using the same in semiconductor packaging
WO03103038A1 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6777265B2 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6812552B2 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
TW531873B Barrier cap for under bump metal
TW502424B Method of forming lead-free bump interconnections
US6638847B1 Method of forming lead-free bump interconnections
US6262477B1 Ball grid array electronic package
US5071381A Process for the manufacture of straw tube drift chambers