| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 4 | |
| #2 | France | 4 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | United States | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ghannam Ayad | 14 |
| Publication | Filing date | Title |
|---|---|---|
| EP3533084A1 | Electronic system comprising an electronic chip forming a package and method for producing same | |
| FR3070091A1 | Electronic system comprising a lower redistribution layer and method for manufacturing such an electronic system | |
| FR3070090A1 | Electronic system and method for manufacturing an electronic system using a sacrificial element | |
| EP3350827A1 | Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit |