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CHI HEEJO

Overview
  • Total Patents
    27
  • GoodIP Patent Rank
    208,069
About

CHI HEEJO has a total of 27 patent applications. Its first patent ever was published in 2009. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors and audio-visual technology are J DEVICES:KK, CHOI DAESIK and 3DIS TECH.

Patent filings in countries

World map showing CHI HEEJOs patent filings in countries
# Country Total Patents
#1 United States 27

Patent filings per year

Chart showing CHI HEEJOs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors
#2 Audio-visual technology

Focus technologies

# Technology
#1 Semiconductor devices
#2 Casings and printed circuits

Top inventors

# Name Total Patents
#1 Chi Heejo 27
#2 Cho Namju 21
#3 Shin Hangil 15
#4 Myung Junwoo 3
#5 Foh Bartholomew Liao Chung 2
#6 Alvarez Sheila Marie L 2
#7 Camacho Zigmund Ramirez 2
#8 Lee Taewoo 2
#9 Cuong Dao Nguyen Phu 2
#10 Park Yeongim 2

Latest patents

Publication Filing date Title
US9406642B1 Integrated circuit packaging system with insulated trace and method of manufacture thereof
US9502267B1 Integrated circuit packaging system with support structure and method of manufacture thereof
US9673171B1 Integrated circuit packaging system with coreless substrate and method of manufacture thereof
US9299650B1 Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof
US2013249104A1 Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die
US2013075927A1 Integrated circuit packaging system with encapsulation and method of manufacture thereof
US2013056863A1 Integrated circuit packaging system with stiffener and method of manufacture thereof
US2012319295A1 Integrated circuit packaging system with pads and method of manufacture thereof
US8288209B1 Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
US2012119393A1 Integrated circuit packaging system with foldable substrate and method of manufacture thereof
US2011309492A1 Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
US2011291283A1 Integrated circuit package system with embedded die superstructure and method of manufacture thereof
US2011285007A1 Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
US2011285009A1 Integrated circuit packaging system with dual side connection and method of manufacture thereof
US2011215450A1 Integrated circuit packaging system with encapsulation and method of manufacture thereof
US2011204494A1 Integrated circuit packaging system with shield and method of manufacture thereof
US2011186977A1 Method of forming thin profile WLCSP with vertical interconnect over package footprint
US2011068444A1 Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
US2011068464A1 Integrated circuit packaging system with package-on-package and method of manufacture thereof
US2011024887A1 Integrated circuit packaging system with through silicon via base and method of manufacture thereof