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DO BYUNG TAI

Overview
  • Total Patents
    80
  • GoodIP Patent Rank
    206,800
About

DO BYUNG TAI has a total of 80 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are PAGAILA REZA A, 3DIS TECH and CHOI DAESIK.

Patent filings in countries

World map showing DO BYUNG TAIs patent filings in countries
# Country Total Patents
#1 United States 80

Patent filings per year

Chart showing DO BYUNG TAIs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors
#2 Machines
#3 Audio-visual technology

Top inventors

# Name Total Patents
#1 Do Byung Tai 80
#2 Chua Linda Pei Ee 52
#3 Trasporto Arnel Senosa 35
#4 Kuan Heap Hoe 21
#5 Chow Seng Guan 10
#6 Pagaila Reza A 9
#7 Huang Rui 8
#8 Pagaila Reza Argenty 6
#9 Yusof Asri 4
#10 Kim Sung Soo 3

Latest patents

Publication Filing date Title
US2014284791A1 Coreless integrated circuit packaging system and method of manufacture thereof
US9147662B1 Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof
US9105620B1 Integrated circuit packaging system with routable traces and method of manufacture thereof
US2015084172A1 Integrated circuit packaging system with side solderable leads and method of manufacture thereof
US9123712B1 Leadframe system with warp control mechanism and method of manufacture thereof
US8937379B1 Integrated circuit packaging system with trenched leadframe and method of manufacture thereof
US9177897B1 Integrated circuit packaging system with trace protection layer and method of manufacture thereof
US9190349B1 Integrated circuit packaging system with leadframe and method of manufacture thereof
US2014197548A1 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
US2014167236A1 Integrated circuit packaging system with transferable trace lead frame
US2014165389A1 Integrated circuit packaging system with routable grid array lead frame
US8623708B1 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof
US2013087902A1 Integrated circuit packaging system with thermal structures and method of manufacture thereof
US2013249118A1 Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof
US2013099365A1 Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof
US2012280376A1 Integrated circuit packaging system with pad connection and method of manufacture thereof
US2013249065A1 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof
US2013249068A1 Integrated circuit packaging system with external interconnect and method of manufacture thereof
US2013249077A1 Integrated circuit packaging system with terminals and method of manufacture thereof
US2012205811A1 Integrated circuit packaging system with terminal locks and method of manufacture thereof