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XIPIN PREC INDUSTRY CO LTD

Overview
  • Total Patents
    37
About

XIPIN PREC INDUSTRY CO LTD has a total of 37 patent applications. Its first patent ever was published in 2000. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and environmental technology are SIGETRONICS INC, PAL ROHIT and RI YUE GUANG SEMICONDUCTOR MFG.

Patent filings in countries

World map showing XIPIN PREC INDUSTRY CO LTDs patent filings in countries
# Country Total Patents
#1 China 37

Patent filings per year

Chart showing XIPIN PREC INDUSTRY CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Huang Jianping 9
#2 Jianping Huang 4
#3 Wu Jiquan 3
#4 Chen Jiaqing Yu 3
#5 Lin Changfu Pu 2
#6 Zhiming Huang 2
#7 Pu Hanping 2
#8 Luo Xiaoyu 2
#9 Jianzhi Chen 2
#10 Hanping Pu 2

Latest patents

Publication Filing date Title
CN101090077A Semiconductor package and its manufacturing method
CN101075565A Packer of semiconductor and its production
CN101075566A Packer of semiconductor and its production
CN101075300A Card-typed circuit module and its production
CN101071798A Semiconductor packaging substrate and semiconductor package with same
CN101000879A Circuit board and construction structure
CN1905140A Image sensor package, optical glass therefor and processing method
CN1901781A Ball planting method and device for applying said method
CN1892196A Electronic component testing system
CN1889260A Semiconductor device capable of holding large size chip and producing method and relative carrier thereof
CN1854028A Electrode packing box
CN1855450A High-heat loss rate semiconductor sealer and its production
CN1617315A Semiconductor package piece
CN1585115A Semiconductor sealer with radiating structure
CN1532921A Semiconductor package part with radiation fin
CN1532922A Semiconductor package part with radiation fin
CN1490858A Spheric grid array semiconductor chip package procedure
CN1466205A Flip Chip type semiconductor package using leadframe as chip carrier
CN1466213A Multi-chip semiconductor package and mfg. method thereof
CN1466178A Semiconductor package method