Learn more

JIANGSU CHANGJIANG ELECTRONICS

Overview
  • Total Patents
    307
  • GoodIP Patent Rank
    34,360
About

JIANGSU CHANGJIANG ELECTRONICS has a total of 307 patent applications. Its first patent ever was published in 2004. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, machines and electrical machinery and energy are HVVI SEMICONDUCTORS INC, DAWNING LEADING TECH INC and CHO NAMJU.

Patent filings in countries

World map showing JIANGSU CHANGJIANG ELECTRONICSs patent filings in countries

Patent filings per year

Chart showing JIANGSU CHANGJIANG ELECTRONICSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xinchao Wang 125
#2 Zhizhong Liang 121
#3 Liang Zhizhong 106
#4 Wang Xinchao 78
#5 Li Weiping 40
#6 Wang Yaqin 38
#7 Liang Xinfu 34
#8 Wang Sunyan 20
#9 Zhang Youhai 18
#10 Zhang Chunyan 17

Latest patents

Publication Filing date Title
CN105280555A Carrier plate stripping machine table and method for stripping carrier plate by using the same
CN105281706A Surface acoustic wave filter encapsulation structure and manufacturing method
CN105185764A Elastic pin POP structure and technique
CN105140138A Electromagnetic shielding encapsulation method and encapsulation structure
CN104992933A Pressed-film chip buried ultra-thin encapsulation structure and manufacturing method thereof
CN104867848A Stitching assembly for die bonder
CN104835772A QFN rear pad pasting ball bonding pressure plate
CN104868872A Surface acoustic wave filter packaging structure
CN104659010A Quad flat no-lead package lead frame structure and package structure
CN104465484A Postcuring fixture set structure
CN104465551A Packaging structure capable of achieving electricity property and heat dissipation through mechanical press mode and process method
CN104485319A Package structure for light-sensing chip and process method thereof
CN104465797A Packaging structure provided with trumpet-shaped opening and used for light-sensing chip and technological method
CN104538378A Wafer level package structure and technological method thereof
CN104465585A Wafer level package structure and technological method thereof
CN104465586A Novel wafer level packaging structure and technological method thereof
CN104465550A Semiconductor face-down bonding structure and technological method thereof
CN104465601A Inverted packaging structure achieving packaging and rewiring by utilizing frame and manufacturing method thereof
CN104485322A Routing packaging structure for packaging and re-routing by utilizing frame and manufacturing method of routing packaging structure
CN104465600A Wire bonding packaging structure for packaging after re-wiring of frame packaging and manufacturing method of wire bonding packaging structure