| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 23 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating | |
| #3 | Environmental technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Coating metallic material | |
| #3 | Climate change mitigation in goods production |
| # | Name | Total Patents |
|---|---|---|
| #1 | Frohberg Kai | 23 |
| #2 | Reiche Katrin | 7 |
| #3 | Werner Thomas | 6 |
| #4 | Feustel Frank | 6 |
| #5 | Griebenow Uwe | 5 |
| #6 | Berthold Heike | 3 |
| #7 | Olligs Dominik | 2 |
| #8 | Schaller Matthias | 2 |
| #9 | Huisinga Torsten | 2 |
| #10 | Ruelke Hartmut | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2013189822A1 | Methods of fabricating integrated circuits with the elimination of voids in interlayer dielectics | |
| US2013072016A1 | Methods of forming conductive contacts with reduced dimensions | |
| US2012313176A1 | Buried sublevel metallizations for improved transistor density | |
| US2012115326A1 | Method of Forming Metal Silicide Regions |