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CONSORTIUM ADVANCED SEMICONDUCTOR MATERIALS & RELATED TECHNOLOGIES

Overview
  • Total Patents
    72
About

CONSORTIUM ADVANCED SEMICONDUCTOR MATERIALS & RELATED TECHNOLOGIES has a total of 72 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Japan and United States. Its main competitors in its focus markets semiconductors and environmental technology are PAL ROHIT, SIGETRONICS INC and XIPIN PREC INDUSTRY CO LTD.

Patent filings in countries

World map showing CONSORTIUM ADVANCED SEMICONDUCTOR MATERIALS & RELATED TECHNOLOGIESs patent filings in countries
# Country Total Patents
#1 Japan 71
#2 United States 1

Patent filings per year

Chart showing CONSORTIUM ADVANCED SEMICONDUCTOR MATERIALS & RELATED TECHNOLOGIESs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Narita Takenori 12
#2 Funatsu Yoshiaki 10
#3 Takimoto Yoshio 10
#4 Ito Masaki 9
#5 Samejima Kenji 8
#6 Koga Kazuhiro 7
#7 Maeda Nobuhide 6
#8 Honma Yoshio 6
#9 Ishizawa Hideaki 5
#10 Tonokawa Hiroshi 5

Latest patents

Publication Filing date Title
JP2010153677A Semiconductor device and manufacturing method of semiconductor device
JP2010153668A Method of manufacturing semiconductor device
JP2009283802A Method of manufacturing semiconductor device
JP2009238801A Process for fabricating semiconductor device, and patterning structure for alignment used at the time of fabricating semiconductor device
JP2009224640A Method for obtaining film characteristics
JP2009218347A Method of manufacturing semiconductor device and semiconductor device
JP2009206138A Method of calculating membrane characteristics
JP2009117666A Insulating film structure and insulating film forming method in wiring of semiconductor device
JP2009038086A Manufacturing method of semiconductor device
JP2009012124A Polishing device and method
JP2009016575A Semiconductor device
JP2008311318A Teg device for assembly resistance evaluation, and assembly resistance evaluating method
JP2008263105A Semiconductor device, method for manufacturing the same device, and device for manufacturing the same device
JP2008251859A Resistivity evaluation element, and resistivity evaluation method
JP2008249518A Film adhesion evaluation method
JP2008251858A Manufacturing method of semiconductor element
JP2008241646A Film adhesiveness evaluation method
JP2008244376A Semiconductor wafer chemical mechanical polishing method and apparatus
JP2008244337A Cmp method
JP2008244338A Semiconductor device and manufacturing method of semiconductor device