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RI YUE GUANG SEMICONDUCTOR MFG

Overview
  • Total Patents
    47
About

RI YUE GUANG SEMICONDUCTOR MFG has a total of 47 patent applications. Its first patent ever was published in 2002. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and environmental technology are ASCATRON AB, XIPIN PREC INDUSTRY CO LTD and SIGETRONICS INC.

Patent filings in countries

World map showing RI YUE GUANG SEMICONDUCTOR MFGs patent filings in countries
# Country Total Patents
#1 China 47

Patent filings per year

Chart showing RI YUE GUANG SEMICONDUCTOR MFGs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Jizong Qiu 3
#2 Yonghui Wang 2
#3 Zheya Zhou 2
#4 Hong Qingfu Wang 2
#5 Guochong Yu 2
#6 Yongli Lu 2
#7 Hong Zhibin Li 2
#8 Wang Jianhao 1
#9 Jizhi Zhu 1
#10 Tsang-Hung Ou 1

Latest patents

Publication Filing date Title
CN101188232A Laminated encapsulation structure and its making method
CN101188233A Interval body has the encapsulating structure of through hole
CN101177235A Packaging construction of micro electromechanical systems and manufacturing method thereof
CN101179069A Electronic element packaging structure
CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure
CN101075580A Method for cutting crystal wafer
CN101026148A Multi-chip build up package structure for optronic chip and its manufacturing method
CN101090100A Chip structure with lug and manufacturing method thereof
CN101090104A Substrate structure for packaging electronic assembly
CN101026108A Flip chip package method and its circuit substrate solder preforms forming method
CN101026107A Wafer level package bump manufacturing method
CN101026133A Semiconductor package structure with radiating fin and its manufacturing method
CN101026141A Coated article package structure with anti-float means
CN101000872A Wafer processing method
CN1940518A Fall impacting device and method of testing thereof
CN1941304A Chip packing process
CN1941333A Chip packing structure
CN1941338A Chip structure and wafer structure
CN1941342A Chip structure and its production
CN1897796A Production of multi-layer circuit board of built-in passive assembly