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XIAN ESWIN SILICON WAFER TECH CO LTD

Overview
  • Total Patents
    58
  • GoodIP Patent Rank
    25,594
About

XIAN ESWIN SILICON WAFER TECH CO LTD has a total of 58 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors, surface technology and coating and machine tools are GRINM SEMICONDUCTOR MATERIALS, BEIJING TONGMEI XTAL TECH CO LTD and LG SILTRON INC.

Patent filings in countries

World map showing XIAN ESWIN SILICON WAFER TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 55
#2 United States 3

Patent filings per year

Chart showing XIAN ESWIN SILICON WAFER TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xu Peng 7
#2 Heng Peng 6
#3 Yang Wenwu 5
#4 Su Jiansheng 5
#5 Lyu Tianshuang 4
#6 Jin Zhuxuan 4
#7 Bai Zongquan 4
#8 Quan Hongyong 3
#9 Li Yunze 3
#10 Jiang Rong 3

Latest patents

Publication Filing date Title
CN112278597A Packaging film and silicon wafer transport box packaging method
CN112275671A Wafer sorting equipment and wafer sorting method
CN112242338A Load port and front end module capable of maintaining cleanliness of FOUP lid
CN112233995A Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer
CN112289700A Silicon wafer detection method
CN112185885A Chuck pin for clamping silicon wafer and device for holding silicon wafer
CN112151432A Device and method for clamping silicon wafers stored in silicon wafer box and silicon wafer conveying equipment
CN112103239A Device for clamping silicon wafer in visual detection process of silicon wafer
CN112103224A Cleaning device, method and related apparatus for cleaning silicon wafer undergoing polishing
CN112103231A Wafer cassette loading device and wafer cassette loading method
CN112091798A Angle polishing device and wafer surface damage depth measuring method
CN112097656A Detection system and detection method for edge removal width of wafer back sealing film
CN112281209A Method, system and storage medium for detecting melt leakage
CN112201568A Method and equipment for epitaxial growth of silicon wafer
CN112192445A Tool, device and method for trimming paired grinding pads of double-sided grinding silicon wafer
CN112160023A Method and system for centering seed crystal rotating rod and crucible rotating base
CN112151423A Method and system for depositing back sealing film on silicon wafer
CN112281207A Heat preservation cover for reducing heat loss of crystal pulling furnace and crystal pulling furnace
CN112151424A Method and system for depositing back sealing film on silicon wafer
CN112048763A Polycrystalline silicon secondary feeding device and polycrystalline silicon ingot casting equipment