BEIJING TONGMEI XTAL TECH CO LTD has a total of 19 patent applications. It increased the IP activity by 166.0%. Its first patent ever was published in 2011. It filed its patents most often in China, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, surface technology and coating and machine tools are LG SILTRON INC, SILTRONIC AG and SILTRON INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 8 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | WIPO (World Intellectual Property Organization) | 5 | |
#4 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Machine tools | |
#4 | Environmental technology | |
#5 | Machines | |
#6 | Optics |
# | Name | Total Patents |
---|---|---|
#1 | Wang Yuanli | 10 |
#2 | Chu Sung-Nee George | 9 |
#3 | Li Haimiao | 7 |
#4 | Wang Liugang | 7 |
#5 | Zhu Songyi | 5 |
#6 | Liu Weiguo | 5 |
#7 | Zhou Yvonne | 4 |
#8 | Shetty Rajaram | 4 |
#9 | Liu Vincent Wensen | 3 |
#10 | Ren Diansheng | 2 |
Publication | Filing date | Title |
---|---|---|
CN110202419A | Single germanium wafer, its preparation method, the purposes of the preparation method of crystal bar and single-chip | |
CN111379027A | Gallium arsenide wafer and preparation method thereof | |
CN108091708A | Single germanium wafer, its preparation method, the purposes of the preparation method of crystal bar and single-chip | |
CN109290875A | The dimpled inp wafer in the back side, preparation method and the corrosive liquid for preparing it | |
CN109290874A | There are inp wafer, preparation method and the corrosive liquid used of olive shape pit in the back side | |
CN107452664A | The method and device of mucous membrane is removed from chip | |
EP2629319A1 | Process for cleaning compound semiconductor wafer |