| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Materials and metallurgy | |
| #3 | Machine tools | |
| #4 | Machines | |
| #5 | Electrical machinery and energy | |
| #6 | Surface technology and coating | |
| #7 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yamada Takashi | 11 |
| #2 | Uno Tomohiro | 11 |
| #3 | Kimura Keiichi | 6 |
| #4 | Terashima Shinichi | 5 |
| #5 | Ikeda Atsuo | 3 |
| #6 | Nishibayashi Akihito | 3 |
| #7 | Oda Daizo | 2 |
| #8 | Oishi Ryo | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2011011619A1 | Bonding wire for semiconductor devices | |
| US2010213619A1 | Wire bonding structure and method for forming same | |
| US2008061440A1 | Copper alloy bonding wire for semiconductor device |